| Technical Specifications |
Performance/
Scalability/Flexibility |
- Up to 16 dual core HP PA-RISC PA-8900 processors
- PA-8900 (1.068 GHz with 3MB L1 cache/64 MB combined L2 cache)
- 1 to 4 cell boards (each cell can accommodate up to 4P/8C and up to 64 GB of memory)
- 2 to 256 GB memory capacity per system
- 16 PCI-X internal hot-plug I/O card slots
- 4 internal disk bays and 2 internal removable media bays (DVD + RW or DAT)
- Optional Server Expansion Unit 2 (SEU-2)
16 additional PCI-X hot-plug I/O card slots
4 additional disk drive slots
2 additional removable media slots (DVD + RW or DAT)
- Up to 2 hard partitions (nPars); up to 4 hardware partitions with optional SEU-2
- Support for up to 16 virtual partitions (vPars); up to 32 virtual partitions with optional SEU
- 138.4 GB/s Peak crossbar bandwidth and 23 GB/s aggregate I/O slot bandwidth (46 GB/s using SEU-2)
- Hot-swap, redundant power supplies
- Redundant (2N+1) input power
- Hot-swap, redundant cooling fans
|
| Operating system |
HP-UX 11i v1 (choice of Foundation, Enterprise, Mission-Critical, and Technical Computing operating environments) |
| Availability |
- Dynamic CPU and memory allocation/de-allocation
- Memory chip-sparing technology
- Hot-plug cell boards
- Error checking and correction (ECC) on all CPU, cache, memory, and I/O paths
- Online addition and replacement of PCI-X I/O cards
- Redundant power inputs for dual grid connections
- N+1 hot-swappable fans and power supplies
- Hot-spare Instant Capacity on Demand CPU functionality
- Electrically isolated hardware partitions (nPars)
- Extensive HP-UX 11i security features: IPSec, IPFilter, LDAP-UX, AAA Server, Secure Shell
|
| Connectivity |
- Core I/O: 10/100/1000Base-T LAN, Ultra3 SCSI, management LAN, 3 serial ports
- Add-in cards: ATM, Token Ring, FDDI, 1000Base-SX, 1000Base-T, 10/100Base-T, Ultra2, Ultra3, FW, Fibre Channel, Terminal MUX, HP Speedcardsoftware, X.25, Hyperfabric, combo cards
|
| Rack-optimized design |
- Rackmount solution offering allows server to fit into 10U (44.45 cm
height) space in all HP racks (Rack System/E and 10000 series rack)
- J1530B: HP field rack kit
- J1530BZ: HP factory rack kit
|
| Physical and Environmental Specifications |
| Physical dimensions |
Height
Width
Depth |
Racked chassis: 29.75 in. (756 mm); 17U EIA
Standalone chassis: 32.8 in. (833 mm)
Server expansion unit: 15.75 in. (400 mm); 9U EIA
19 in. (483 mm)
30 in. (762 mm)
|
| Net weight |
Maximum configuration |
Chassis: 378 lb. (171.4 kg)
Server expansion unit: 180 lb. (81.65 kg) |
| Temperature |
Operating
Non-operating
Maximum rate of temperature change |
+41° to +95° F (+5° to +35° C); 86° F (30° C) @ 10,000 ft. (3000 m)
–40° to +158° F (–40° to +70° C)
36° F (20° C) per hr
|
| Humidity |
Operating |
15% to 80% RH non-condensing |
| Altitude |
Maximum operating
Maximum non-operating |
10,000 ft. (3000 m)
15,000 ft. (4500 m) |
| Power requirements |
Typical power dissipation
|
3,789 VA (max. configuration)
18.95 A @ 200 V
Server expansion unit: 662 VA (max. configuration)
|
| Regulatory |
Safety
Electromagnetic interference
Power line LF emissions |
UL listed, CUL certified, TÜV GS Mark, compliant with EN 60950
Complies with FCC rules and regulations, Part 15 as a Class A Digital Device; Manufacturer's Declaration to EN55022 Level A, VCCI
Registered, Class I, Korea RLL
Europe: EN 61000-3-2; Europe: EN 61000-3-3
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